Ultra Flat Silicon
Individually packed wafers are convenient and ready to use. Polished silicon exhibits low roughness. Atomically flat surface enables high resolution imaging for AFM and SEM.
The properties of the wafers are detailed below
Dimensions: 100 mm dia.
Thickness: 525 plus minus 25 Î¼m
Resistivity: 1 20 ohm cm
Roughness: 2 3 angstrom