Call UsCall Us : +918452810712

Printing Material

Product Image (GFET-S10)

GFET-S10 for Sensing applications

TYPICAL SPECIFICATIONS · Growth method: CVD synthesis · Chip dimensions: 10 mm x 10 mm · Chip thickness: 675 μm · Number of GFETs per chip: 36 · Gate oxide thickness: 90 nm · Gate oxide material: SiO2 · Dielectric Constant of the SiO2 layer: 3.9 · Resistivity of substrate: 1-10 Ω.cm · Metallization: Chromium/Gold 2/50nm · Graphene field-effect mobility: >1000 cm2/V.s · Dirac point: <50 V · Minimum working devices: >75 % ABSOLUTE MAXIMUM RATINGS · Maximum gate-source voltage: ± 50 V · Maximum temperature rating: 150 °C · Maximum drain-source current density 107A.cm-2

Product Image (GFET-S11)

GFET-S11 for Sensing applications

TYPICAL SPECIFICATIONS · Growth method: CVD synthesis · Chip dimensions: 10 mm x 10 mm · Chip thickness: 675 μm · Number of GFETs per chip: 31 · Gate oxide thickness: 90 nm · Gate oxide material: SiO2 · Dielectric Constant of the SiO2 layer: 3.9 · Resistivity of substrate: 1-10 Ω.cm · Metallization: Chromium/Gold 5/45nm · Graphene field-effect mobility: >1000 cm2/V.s · Dirac point: <50 V · Minimum working devices: >75 % ABSOLUTE MAXIMUM RATINGS · Maximum gate-source voltage: ± 50 V · Maximum temperature rating: 150 °C · Maximum drain-source current density 107A.cm-2

Product Image (GFET-S12)

GFET-S12 for Sensing applications

TYPICAL SPECIFICATIONS · Growth method: CVD synthesis · Chip dimensions: 10 mm x 10 mm · Chip thickness: 675 μm · Number of GFETs per chip: 27 · Gate oxide thickness: 90 nm · Gate oxide material: SiO2 · Dielectric Constant of the SiO2 layer: 3.9 · Resistivity of substrate: 1-10 Ω.cm · Metallization: Chromium/Gold 5/45nm · Graphene field-effect mobility: >1000 cm2/V.s · Dirac point: <50 V · Minimum working devices: >75 % ABSOLUTE MAXIMUM RATINGS · Maximum gate-source voltage: ± 50 V · Maximum temperature rating: 150 °C · Maximum drain-source current density 107A.cm-2

Product Image (GFET-S20)

GFET-S20 for Sensing applications

TYPICAL SPECIFICATIONS · Growth method: CVD synthesis · Chip dimensions: 10 mm x 10 mm · Chip thickness: 675 μm · Number of GFETs per chip: 36 · Gate oxide thickness: 90 nm · Gate oxide material: SiO2 · Resistivity of substrate: 1-10 Ω.cm · Metallization: Chromium/Gold-Palladium 2/50 nm · Graphene field-effect mobility: >1000 cm2/V.s · Encapsulation: 50 nm Al2O3 + 100 nm Si3N4 · Dirac point (back gating): <50 V · Dirac point (liquid gating): <1V · Minimum working devices: >75 % ABSOLUTE MAXIMUM RATINGS · Maximum gate-source voltage: ± 50 V · Maximum temperature rating: 150 °C · Maximum drain-source current density 107A.cm-2

Product Image (GFAB)

GFAB - Graphene Foundry Service

PROCESSING SPECIFICATIONS · Batch Size: from 40 cm2 to 1000s · Mask: according to design rules, and can be printed by customer or Graphenea · Graphene growth, transfer, processing and dicing under one roof · Metallization: Cr/Au as standard. Optional wetting layers: Ni, Ti. Optional contact layers: Al, AuPd · Encapsulation: polymeric, ALD Al2O3 or ALD Al2O3 +Si3N4 · Minimum feature size: 5 μm · Dicing · Get in touch for a quote QUALITY CONTROL All our samples are subjected to a rigorous QC in order to ensure a high quality products. · Raman Spectroscopy inspection · Optical Microscopy inspection · Electrical conductivity on test structures

Product Image (SKU - G6-Impact)

G6-Impact Filament

Applications: Damping is the energy dissipation property of material that reflects its ability to convert mechanical energy to thermal energy. The amount of energy dissipated is the measure of material damping ability. Vibration damping is highly beneficial in eliminating noise in structural, optical and electronic components. The G6-Impact™material is also available in pelleted form which can be best utilized for injection molding, extrusion or thermoforming. The G6-Impact™material will deliver benefits in multiple everyday use gadgets like smartphones, cameras, and laptop computers where interconnections can be destroyed or weakened due to vibrations caused by moving internal parts or external stress and shock. Similarly, G6-Impact™ can be used for stabilization of sensitive scientific instruments, optical holders, microscope and laser mounts and pads. In automotive, military and aviation industries, G6-Impact™ can reduce vehicle and in-flight vibrations, and can be used as base material for cable and equipment mounts and platforms. Moreover, G6-Impact™ will be useful in industrial setting to reduce vibrations in bearing and structures. Thermoformed tiles can used to reduce noise and vibrations from heavy machinery etc. It can also be employed in tool handles, protective seals and mats, and construction footwear.Sporting gears made out of G6-Impact™ may include golf club and baseball bat handles, where vibrational shock to joints leads to trauma and fatigue. Pliable G6-Impact™ material is highly machinable and can be drilled through, cut, screwed or polished. It is very malleable and will sustain a great deal of hammering and pressure deformation in a way similar to metals before failure. Also, inserting a layer of G6-Impact™ may protect other adhesive substrates from debonding or delamination due to vibrations by enhancing overall lifetime and integrity of the objects. This unique property perfectly fills the niche where catastrophic/instant failure is not an option. Its damping properties expand through a large temperature range (-40 oC to 90oC) setting apart and making it highly suitable to extreme conditions both indoors and outdoors. Please contact us if any further guidance is needed in that respect.

Product Image (SKU - GRPHN-PLA)

Conductive Graphene PLA Filament

Conductive Graphene PLA Filament Conductive Graphene PLA Filament, a material by Graphene 3D Lab, is specifically designed to allow you to 3D print electrically conductive components using almost any commercially available desktop 3D printer! By purchasing this filament, you agree that you have read and agree to the product description below, including the handling and disclaimer statements.

Product Image (SKU - RB-STEEL)

Robotic Steel

Printing Parameters: . Avoid leaving filament in a heated nozzle for an extended period of time. . Recommended Printing Temperature: 225°C . Recommended Bed Temperature: 50- 60°C . Recommended Printing Speed: 30-60 mm/sec . Infill speed: Maximum of 70 mm/sec . Extrusion Multiplier: 0.9-0.95

Product Image (18)

Conductive Flexible TPU Filament

Price: 150.00 - 300.00 INR
  • Supply Ability:1 kg Per Day
  • Delivery Time:15 Days
Product Image ( 12)

Scorpion (Flexible) Nylon 1.75 mm

Price: 150.00 - 300.00 INR
  • Supply Ability:1 kg Per Day
  • Delivery Time:15 Days
Product Image (13)

3D Multilayer Freestanding Graphene Foam, 2"x2"

Price: 150.00 - 300.00 INR
  • Supply Ability:1 kg Per Day
  • Delivery Time:15 Days
Product Image (15)

Ferro-Magnetic PLA

Price: 150.00 - 300.00 INR
  • Delivery Time:15 Days
  • Supply Ability:1 kg Per Day
Product Image (20)

3D Printing Filament

Price: 150.00 - 300.00 INR
  • Supply Ability:1 kg Per Day
  • Delivery Time:15 Days
Product Image (01)

3D Printing Materials

Price: 150.00 - 300.00 INR
  • Supply Ability:1 kg Per Day
  • Delivery Time:15 Days
X