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Sputtering Target

Sputtering Target

Product Details:

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Product Description



Features:
• From standard, single element materials to custom compounds, small circular to Multiple Tile and stepped constructions, and commercial grade to ultra-high purities
• We utilize a variety of specialized processing techniques such as hot pressing, hot isostatic pressing (HIP), and cold isostatic pressing (CIP), induction vacuum melting, and vacuum casting to produce homogenous, fine-grained, high-density materials that conform to the strictest application standards
• Provides a full range of sputtering target materials including: precious metals, pure metals, alloys, ceramics, cermet, boride, oxides, carbides, nitrides, silicates, and fluorides
• Purities range from commercial grade (99.5%) to ultra high (99.9999%)
• Backing plates used in the sputtering process are essential to creating a quality thin film deposition for your product. We offer to back plates in both standard configurations and custom dimensions to meet your specific requirements. We also offer complete bonding services to provide a complete solution
1. Pure Metal Sputtering Target
Al, Sb, Bi, B, CD, C, Ce, Cr, Co, Cu, Dy, Er, Eu, Gd, Ge, Au, C, Hf, Ho, In, Ir, Fe, La, Lu, Mg, Mn, Mo, Nd, Ni, Nb, Pd, Pt, Pr,Re, Ru, Sm, Se, Sc, Ag, SI, Ta, Tb, Tm, Sn, Ti, W, V, Yb, Y, Zr, Zn, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Sc,Y
2. Alloy sputtering Target

AlCu, AlCr, AlMg, AlSi, AlSiCu, AlAg, AlV, CaNiCrFe, CaNiCrFeMoMn, CeGd, CeSm, CrSi, CoCr, CoCrMo, CoFe, CoFeB, CoNi, CoNiCr, CoPt, CoNbZr, CoTaZr, CoZr, CrV, CrB, CrSi, CrCu, CuCo, CuGa, CuIn, CuNi, CoNiPt, CuZr, DyFe,DyFeCo, FeB, FeC, FeMn, GdFe, GdFeCo, HfFe, IrMn, IrRe, InSn, MoSi, NiAl, NiCr, NiCrSi, NdDyFeCo, NiFe, NiMn, NiNbTi,NiTi, NiV, SmCo, AgCu, AgSn, TaAl, TbDyFe, TbFe, TbFeCo, TbGdFeCo, TiAl, TiNi, TiCr, WRe, WTi, WCu, ZrAl, ZrCu, ZrFe,ZrNb, ZrNi, ZrTi, ZrY, ZnAl, ZnMg

3. Oxide sputtering Target or ceramic target

Al2O3, Sb2O3, ATO, BaTiO3, Bi2O3, CeO2, CuO, Cr2O3, Dy2O3, Er2O3, Eu2O3, Gd2O3, Ga2O3, GeO2, HfO2,Ho2O3, In2O3, ITO, Fe2O3, Fe3O4, La2O3, PbTiO3, PbZrO3, LiNbO3, Lu3Fe5O12, Lu2O3, MgO, MoO3, Nd2O3, Pr6O11, Pr,(TiO2) 2, Pr2O3, Sm2O3, Sc2O3, SiO2, SiO, SrTiO3, SrZrO3, Ta2O5, Tb4O7, TeO2, ThO2, Tm2O3, TiO2, TiO, Ti3O5, Ti2O3, SnO2, SnO, WO3, V2O5, YAG, Y3Al5O12, Yb2O3, Y2O3, ZnO, ZnO: Al, ZrO2 (unstabilized) , ZrO2-5-15wt% CaO)

4. Metal boride sputtering Target:

Cr2B, CrB, CrB2, Cr5B3, FeB, HfB2, LaB6, Mo2B, Mo2B5, NbB, NbB2, TaB, TaB2,   TiB2, W2B, WB, VB, VB2, ZrB2

5. Metal Carbide sputtering Target:

 B4C, Cr3C2, HfC, Mo2C, NbC, SiC, TaC, TiC, WC, W2C, VC, ZrC

6. Fluoride sputtering Target

AlF3, BaF3, CdF2, CaF2, CeF3, DyF3, ErF3, HfF4, KF, LaF3, PbF2, LiF, PrF3, MgF2, NdF3, ReF3, SmF3, NaF, Cryolite, Na3AlF6, SrF2, ThF4, YF3, YbF3

7. Nitride sputtering Target
            AlN, BN, GaN, HfN, NbN, Si3N4, TaN, TiN, VN, ZrN
8. Selenide sputtering Target

Bi2Se3, CdSe, In2Se3, PbSe, MoSe2, NbSe2, TaSe2, WSe2, ZnSe

9. Silicide sputtering Target

Cr3Si, CrSi2, CoSi2, HfSi2, MoSi2, NbSi2, TaSi2, Ta5Si3, TiSi2, Ti5Si3, WSi2, V3Si, VSi2, ZrSi2


ULTRANANOTECH PRIVATE LIMITED

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