Patterned gold thin films on glass fabricated via e-beam metal evaporation. Titanium adhesion layer between gold and glass improves mechanical stability of gold film. Gold films exhibit high purity (99.999%) and low surface roughness (nanometer-scale roughness). These electrodes are fabricated without photoresist or organic solvents which may contaminate the surface of gold. Ideal for applications in MEMS Biosensors (bioMEMS), chemical sensor chips and microelectrodes.
This5-probe microelectrode can be used for measuring sheet resistance (e.g. 4-pointprobe or kelvin method), impedance or conductivity of biological tissues, 2Dmaterials, nanomaterials, polymers, advanced materials. Gap distance: 345Âµm Â± 5Âµm; Finger width: 160 Â± 10 Âµm; Chip dimensions: 20 mm x 10 mm x 0.7 mm; 8chips per pack.
Thethree (3) probe microelectrode chip is ideal for designing and testing newchemical sensors. Gold provides high conductivity, and the transparentsubstrate allows for optical imaging of sensing layer. Applications includetransistors (FETs, HEMTs, BioFETs), chemical sensors and biosensors. Gapdistance: 350 Âµm Â± 5 Âµm; Finger width: 150 Âµm Â± 5 Âµm; Chip dimensions: 20 mm x10 mm x 0.7 mm; 8 chips per pack.
Thisdisk electrode chip is ideal for electrochemical experiments of solutions anddroplets via electrochemical impedance spectroscopy (EIS) or cyclicvoltammetry. The center disk electrode serves as working electrode, whileeither one of the side electrodes can serve as auxiliary electrode or referenceelectrode. Gap distance: 490 Âµm Â± 7 Âµm; Finger width: 270 Âµm Â± 5 Âµm;Diameter of working electrode: 590 Âµm Â± 5 Âµm. Chip dimensions: 20 mm x 10 mm x0.7 mm; 8 chips per pack